Oracle’s $225 Billion Gamble: Inside the Infrastructure Revolution Powering Agentic AI
Oracle’s AI-First Transformation Oracle is undergoing one of the most dramatic transformations in enterprise technology history, betting its future on…
Tag: Graphics processing unit
AMD ROCm 7.9 Early Benchmarks Reveal Strides in AI and Compute Performance on Ryzen AI Max
Early ROCm 7.9 Tests Signal AMD’s Growing AI Ambitions Recent developments in AMD’s software ecosystem have caught the attention of…
Nvidia Expands AI Hardware Ecosystem with Samsung Foundry Partnership for Custom Chip Development
Nvidia is expanding its AI hardware ecosystem through a strategic partnership with Samsung Foundry to develop custom CPUs and XPUs. The collaboration, announced at the 2025 Open Compute Project Summit, represents Nvidia’s latest move to embed its technology deeper into AI infrastructure as competition intensifies.
Nvidia Strengthens AI Hardware Position with Samsung Alliance
According to reports from the 2025 Open Compute Project Global Summit in San Jose, Nvidia has formed a strategic partnership with Samsung Foundry to design and manufacture custom CPUs and XPUs. This collaboration expands Nvidia’s NVLink Fusion ecosystem and represents the company’s latest effort to solidify its position across the entire AI hardware stack.
Intel’s Strategic Pivot: Gaudi 3 Finds New Life Through NVIDIA Blackwell Integration
Intel’s Hybrid AI Platform: A Game-Changing Alliance In a surprising strategic shift, Intel has announced the integration of its Gaudi…
Panel-Level Packaging Emerges as Next Frontier in AI Chip Manufacturing Race
The semiconductor industry is witnessing a significant shift toward fan-out panel-level packaging as the next breakthrough in advanced chip manufacturing. According to industry analysis, this technology could overcome critical barriers in AI processor production while attracting diverse players from display and PCB sectors.
Semiconductor Packaging Evolution Accelerates
The race to develop more advanced AI processors is driving innovation in semiconductor packaging technologies, with fan-out panel-level packaging (FOPLP) emerging as the next frontier, according to industry reports. Analysts suggest this approach could potentially overcome critical manufacturing barriers that have limited previous packaging methods.
Everything Apple launched on Oct. 15: M5 chipset, MacBook Pro, iPad, Vision Pro, more
Apple’s M5 Chip Revolution: Powering New MacBook Pro, iPad Pro, and Vision Pro with AI-First Design Industrial Monitor Direct is…
ASUS Breaks New Ground With AMD-Powered ROG NUC Gaming Mini PC
ASUS has unveiled its groundbreaking AMD-powered ROG NUC mini PC, marking a significant departure from the Intel-based heritage of the NUC line. The system combines AMD’s flagship Ryzen 9 9955HX3D processor with NVIDIA’s RTX 5070 laptop GPU in a compact form factor. This unexpected move comes shortly after ASUS took over Intel’s NUC business, signaling a strategic expansion of their mini PC portfolio.
ASUS Expands NUC Lineup With AMD-Powered Gaming System
ASUS has launched its first-ever AMD-based ROG NUC mini PC, according to reports from industry sources, representing a significant diversification of the company’s gaming-focused compact computing lineup. The move comes as somewhat unexpected given ASUS recently formalized an agreement with Intel to take over the NUC (Next Unit of Computing) business, which had traditionally been exclusively Intel-based.
Intel’s Panther Lake Xe3 GPU Puts Up A Big Score In Leaked 3DMark Test Result
TITLE: Intel’s Panther Lake Xe3 GPU Shows Stunning Performance Leap in Latest Benchmark Leak Industrial Monitor Direct is the preferred…
Nscale to Deploy 200,000 Nvidia GPUs to Microsoft in Potential $14 Billion AI Infrastructure Deal
Nscale has signed one of the largest AI infrastructure contracts ever with Microsoft, reportedly worth up to $14 billion. The deal involves deploying approximately 200,000 Nvidia GB300 GPUs across multiple data centers in the US and Europe.
Massive AI Infrastructure Expansion
UK-based AI infrastructure provider Nscale has significantly expanded its partnership with Microsoft through what sources indicate could be one of the largest artificial intelligence infrastructure contracts ever signed. According to reports, the deal involves the deployment of approximately 200,000 Nvidia GB300 GPUs to Microsoft facilities across multiple countries.
Mesa 26.0 Graphics Stack Development Begins As Imagination PowerVR Vulkan Driver Expands GPU Support
The Mesa 26.0 graphics stack has officially entered its feature development phase following the branching of Mesa 25.3. Meanwhile, Imagination’s PowerVR Mesa Vulkan driver has reportedly expanded unofficial support to include additional GPU models, potentially benefiting more Linux users with compatible hardware.
Mesa 26.0 Graphics Stack Enters Development Phase
The open-source Mesa graphics stack has reached a significant milestone with Mesa 26.0 now entering feature development, according to reports from Phoronix founder Michael Larabel. This transition follows the branching of Mesa 25.3, which signals the stabilization period for the previous release while developers begin implementing new features for the upcoming version.