Beyond Tariffs: How China’s Rare Earth Strategy Reshapes Global Tech Supply Chains
The Geopolitical Chessboard: Rare Earths as Strategic Assets While recent headlines have focused on tit-for-tat tariff increases between Washington and…
Tag: Advanced packaging (semiconductors)
Panel-Level Packaging Emerges as Next Frontier in AI Chip Manufacturing Race
The semiconductor industry is witnessing a significant shift toward fan-out panel-level packaging as the next breakthrough in advanced chip manufacturing. According to industry analysis, this technology could overcome critical barriers in AI processor production while attracting diverse players from display and PCB sectors.
Semiconductor Packaging Evolution Accelerates
The race to develop more advanced AI processors is driving innovation in semiconductor packaging technologies, with fan-out panel-level packaging (FOPLP) emerging as the next frontier, according to industry reports. Analysts suggest this approach could potentially overcome critical manufacturing barriers that have limited previous packaging methods.