AMD Enters ARM Market with Sound Wave APU on TSMC 3nm Process
AMD is expanding beyond x86 architecture with its first ARM-based APU, codenamed “Sound Wave.” Built on TSMC’s 3nm process, the chip targets 5-10W TDP with hybrid cores and RDNA 3.5 graphics. The processor is expected to power Microsoft Surface devices in 2026.
AMD is making a strategic entry into the ARM market with its groundbreaking “Sound Wave” APU, marking the company’s first significant foray beyond x86 architecture in over a decade. The custom-built processor, manufactured on TSMC’s advanced 3nm process, represents AMD’s direct challenge to Qualcomm’s dominance in the low-power computing segment. According to customs import records that confirmed the chip’s specifications, Sound Wave features a compact BGA-1074 package measuring 32 mm × 27 mm, positioning it perfectly for next-generation thin and light devices where energy efficiency and AI capabilities are becoming increasingly critical.