HardwareManufacturingTechnology

Foxconn to Double AirPods Production Capacity in India by Early 2026

Foxconn is reportedly scaling up AirPods production in India, with plans to double manufacturing capacity at its Hyderabad facility by early 2026. The expansion would increase monthly output to approximately 200,000 units while growing the workforce from 2,000 to 5,000 employees. This move represents Apple’s continued supply chain diversification beyond China.

Apple’s AirPods manufacturing footprint in India is set for significant expansion, with Foxconn reportedly planning to double production capacity at its Hyderabad facility within the coming months. According to sources familiar with the matter, this strategic move would mark a substantial escalation of Apple’s manufacturing diversification beyond China.

Manufacturing Scale-Up Underway

HardwareSemiconductorsTechnology

Samsung Enters HBM4 Memory Race with Public Debut, Challenging SK Hynix and Micron

Samsung has publicly showcased its HBM4 memory modules for the first time, signaling a major push in the high-bandwidth memory competition. The company reportedly achieves 90% logic die yield and faster pin speeds than competitors. This development sets the stage for a heated three-way battle in the AI memory market.

Samsung’s Strategic HBM4 Reveal

Samsung Electronics has publicly unveiled its HBM4 memory modules for the first time, according to reports from the Semiconductor Exhibition (SEDEX) 2025. This move positions the Korean technology giant directly against competitors SK Hynix and Micron in the increasingly competitive high-bandwidth memory market. Industry analysts suggest this public demonstration indicates Samsung’s readiness for mass production and represents a significant comeback attempt following years of reportedly sluggish performance in the DRAM segment.

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SOT-MRAM Breakthrough: From Lab to Mass Production With β-Tungsten Stability

After years of laboratory development, spin-orbit torque magnetic memory has overcome its fundamental materials stability barrier. A multinational research team has stabilized β-phase tungsten against manufacturing temperatures, creating 64-kilobit SOT-MRAM chips that combine SRAM-like speed with true non-volatility.

After decades confined to research laboratories, spin-orbit torque magnetic random-access memory (SOT-MRAM) appears poised for commercial deployment following a critical materials science breakthrough. An international research collaboration has solved the persistent stability problem of β-phase tungsten, the conductive material essential for generating the spin currents that enable SOT-MRAM’s ultrafast data rotation and switching capabilities.

The β-Tungsten Stability Challenge